In recent years work performed in the Surface Mount Technology (SMT) industry has demonstrated that convection heat and the 'tent', or 'straight ramp' profile, is a superior thermal process for reflowing surface mount assemblies. This is particularly important with the increased use of no-clean solder pastes where the dwell or soak time in an oven using other profile patterns serves to deplete the less active fluxes in no-clean pastes, before they can reflow. An additional advantage is that it speeds up the reflow process by reducing the time an assembly resides in the oven, increasing the average throughput. It has also been reported that soak zones, a component of other profiles, are generally not needed to activate solder paste chemistry. This is a common misconception.
ACCU-HEAT II convection ovens produce the 'tent', or 'straight ramp', profile. Unlike alternative thermal source systems that heat different parts of an assembly at varying rates, and at times with significant delta T's, which can lead to a variety of solder defects, the ACCU-HEAT II's closed-loop convection process circulates heated air evenly on and around SMT assemblies, heating them uniformly with insignificant delta T's, regardless of component mix, color, texture, or thickness. The ovens internal baffling arrangement provides a controlled temperature ramp, and thermal shock to components is virtually eliminated. Non-load dependent, the oven will produce the same quality product results with a single assembly or when fully loaded.
ACCU-HEAT II convection ovens, Models II-12 and II-12S are ideal for laboratory, prototype, and low to medium production of SMT/PCB's. Their unlimited profile capability, and exceptional precision, produces consistent, in-spec, quality results.
Curing and Drying / Heat Shrink Tubing
All Information Contained Herein © 2004 Strategic Products, Inc
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